Manufacturing Capabilities

 

CapabilitiesStandard
Production
Advanced
Production
Development
Layer Count1 – 12 Layers13 – 32 Layers> 32 Layers
Max Board Thickness2.40mm6.00mm10.00mm
Min Board Thickness0.20mm0.10mm0.075mm
Copper ThicknessUp to 3oz 105 μmUp to 15oz 525 μm> 15oz
Track & gaps0.005” 0.13mm0.003” 0.076mm0.002” 0.05mm
Annular Ring0.006” 0.15mm0.004” 0.10mm0.002” 0.05mm
Minimum Drill Hole0.25mm0.15mm0.10mm
Aspect ratio8 : 115 : 118 : 1
Blind vias0.40mm0.12mm< 0.12mm

PW Circuits is constantly striving to improve itself.  If you have a design that exceeds our capablities then please get in contact with us anyway. We are always very happy to work with you to meet your requirements!


Surface FinishesStandard
Production
Advanced
Production
HASL ( Tin Lead Non RoSH)5.0 μm – 35.0 μm
HASL (Lead free RoSH)5.0 μm – 35.0 μm
Immersion Silver0.15 μm – 0.20 μm
Electroless Nickel3.0 μm – 5.0 μm
Immersion Gold0.05 μm – 0.08 μm0.05 μm – 0.12 μm
Electroless Palladuim0.20 μm – 0.50 μm
Electrolytic Nickel3.0 μm – 5.0 μm3.0 μm – 7.0 μm
Electrolytic Gold1.5 μm – 3.0 μm0.5 μm – 5.0 μm
Pure soft Gold1.0 μm – 5.0 μm
Organic Solderability
Preservatives (OSP)
0.10 μm – 0.20 μm