Manufacturing Capabilities
| Capabilities | Standard Production | Advanced Production | Development |
|---|---|---|---|
| Layer Count | 1 – 12 Layers | 13 – 32 Layers | > 32 Layers |
| Max Board Thickness | 2.40mm | 6.00mm | 10.00mm |
| Min Board Thickness | 0.20mm | 0.10mm | 0.075mm |
| Copper Thickness | Up to 3oz 105 μm | Up to 15oz 525 μm | > 15oz |
| Track & gaps | 0.005” 0.13mm | 0.003” 0.076mm | 0.002” 0.05mm |
| Annular Ring | 0.006” 0.15mm | 0.004” 0.10mm | 0.002” 0.05mm |
| Minimum Drill Hole | 0.25mm | 0.15mm | 0.10mm |
| Aspect ratio | 8 : 1 | 15 : 1 | 18 : 1 |
| Blind vias | 0.40mm | 0.12mm | < 0.12mm |
PW Circuits is constantly striving to improve itself. If you have a design that exceeds our capablities then please get in contact with us anyway. We are always very happy to work with you to meet your requirements!
| Surface Finishes | Standard Production | Advanced Production |
|---|---|---|
| HASL ( Tin Lead Non RoSH) | 5.0 μm – 35.0 μm | |
| HASL (Lead free RoSH) | 5.0 μm – 35.0 μm | |
| Immersion Silver | 0.15 μm – 0.20 μm | |
| Electroless Nickel | 3.0 μm – 5.0 μm | |
| Immersion Gold | 0.05 μm – 0.08 μm | 0.05 μm – 0.12 μm |
| Electroless Palladuim | 0.20 μm – 0.50 μm | |
| Electrolytic Nickel | 3.0 μm – 5.0 μm | 3.0 μm – 7.0 μm |
| Electrolytic Gold | 1.5 μm – 3.0 μm | 0.5 μm – 5.0 μm |
| Pure soft Gold | 1.0 μm – 5.0 μm | |
| Organic Solderability Preservatives (OSP) | 0.10 μm – 0.20 μm |