Ceramic PCB Materials
Alumina (Al2O3) and Aluminum Nitride (AlN) are environmentally-friendly substrate materials to replace BeO (Beryllium Oxide) for your RF resistors and terminations for high power application ceramic PCBs. We can offer both single (conventional) and double (PTH) sided printed circuit boards.
The thermal conductivity also makes these ideal substrates for high heat components including LEDs.
Alumina ceramic substrates
High-purity alumina setters are ideal for quality improvement and cost reduction. Since high-purity Alumina has excellent corrosion resistance and thermal shock resistance. It is used for setters for sintering and heat treatment.
This is our preferred current Alumina material.
91% / 92% / 96%/99.6% Alumina Data sheet
CeramTec is a global leader in the field of production and supply of advanced ceramics and engineers these materials for use in a wide variety of applications. CeramTec supplies with the current portfolio well over 10,000 different products, components and parts made of advanced ceramics.
96% / 99.6% Alumina Introduction of Ceramic Materials Data sheet
Aluminum Nitride ceramic substrates
While most of their products are rather small, they can have a great effect. They are the market and technology leader for ceramic substrates. These products are used almost everywhere in our highly technical 21st century world, contributing to efficient energy management.
Curamilk Al2O3 HPS Si3N4 AlN Data sheet
Building on Corning’s 160 years of innovation, MACOR® machinable glass ceramic is a solid, trusted foundation that can help you realize your designs quicker. Its unique combination of properties makes it an easily machinable, versatile, and high performing material even in harsh operating environments where precision is a necessity. MACOR reduces fabrication times and is tested to fit complex design requirements even within a short turnaround time, as it remains stable at high temperatures and high pressure.
Macor Macor machinable glass ceramic Data sheet
Typical Property Values
Property FR4 Al2 O3 AlN Macor Dielectric constant (1 MHz @ RT) 9.8 8.9 Dielectric Loss (1 MHz @ RT) <1014 <1014 Thermal Conductivity (W /m K) 0.8-1.1 36 170-190 1.46 Coefficient of Thermal Expansion (ppm/°C) 36 170-190 Density (g/cm3) 2.89 3.30 Bending Strength (mPa) 380 290 Hardness (Knoop) (GPa) 14.1 11.8 Young’s Modulus (GPa) 372 331
Please note that the data provide here is only advisory and you should check directly with the manufacturer in case of any updates or incorrect data.