Polyimide PCB Material

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The demand for high speed/high density printed circuit board (PCB) packaging compels the use of advanced packaging technologies, including embedded passives, in new circuit designs. OhmegaPly® has become the technology of choice in many critical circuit applications. It is used globally as a high volume, cost effective alternative to discrete SMT resistors.

There are numerous benefits in using OhmegaPly® including reduced surface EMI (Electrical Magnetic Interference), reduced inductive reactance, improved signal integrity of high speed, high frequency circuits and greater reliability resulting from the elimination of solder joints required for surface mounted resistors. More routing area is made available with elimination of the discrete SMT resistors and their interconnecting traces and vias.

OhmegaPly resistors are thin film planar resistive elements that are part of the printed and etched circuitry on a standard PCB layer. OhmegaPly RCM® (Resistive Conductive Material) is comprised of a copper-conducting layer (copper foil) and a thin-film resistive alloy layer that has been deposited onto the “tooth” or matte side of the copper foil. The copper foils are single and double treat copper and are available in 1/2 oz (17 micron) and 1 oz (35 micron) weights.

PCB with the embedded resistors exposed

The OhmegaPly RCM® is available in a number of standard sheet resistivities expressed in ohms per square: 10 ohms/Sq, 25 ohms/Sq, 50 ohms/Sq, 100 ohms/Sq and 250 ohms/Sq.

Based on original equipment manufacturers (OEM) and PCB requirements, the OhmegaPly RCM® is laminated by independent laminators or PCB manufacturers to specific dielectric materials. It can be bonded to virtually any dielectric material and thickness currently being used by the Industry.

OhmegaPly® is a nickel-phosphorous (NiP) metal alloy that is electrodeposited onto the matte, or tooth side, of copper foil. The thin film NiP metal alloy/copper foil combination is called OhmegaPly RCM® (Resistor Conductor Material). RCM is laminated to a dielectric material (like any other copper foil) and subtractively processed (Print and Etch) to produce copper circuitry and planar resistors. Because of its thin film nature, it can be embedded within layers without increasing the thickness of the board or occupying any board surface area as is required for discrete chip resistors.

Please note that the data provide here is only advisory and you should check directly with the manufacturer in case of any updates or incorrect data.