Aluminium IMS PCB substrates
Aluminium backed PCBs are now being used in place of traditional FR4 PCBs for high power LED applications. This is due to rapidly changing developments in LED technology, with brighter more powerful LED’s coming on to the market. This raises a problem for designers with larger amounts of heat being generated by the components, the answer is IMS (Insulated Metal Substrate) PCBs.
Aluminium backed PCBs with the use of thermally conductive pre-preg between the copper and the aluminium the thermal performance is 8–10 times better than a standard epoxy glass (FR4) PCB. We are able to manufacture single sided, PTH or multilayer Aluminium backed PCBs to your requirements.
Ventec International group substrates
Ventec’s IMS (Insulated Metal Substrate) families, laminates and prepregs for multilayer PCBs, leverage innovative formulas for excellent thermal performance. Selective-preference VT-4B5SP extend choice and design freedom even further. Versatile choice of formable substrates, selective dielectric and conductivity from 2.2 W/mK to 10 W/mK.
| VT-4BC | Metal Base Laminate, 10W/mK | Data sheet |
| VT-4B7 SP | IMS, Non-Glass, 7W/mK | Data sheet |
| VT-4B7 | IMS, Non-Glass, 7W/mK | Data sheet |
| VT-4B5 SP | IMS, Non-glass, 4.2W/mK | Data sheet |
| VT-4B5H | Metal Base Laminate, 4.2W/m.k, High Tg 210, MOT 150 | Data sheet |
| VT-4B5L | Metal Base Laminate, 3.6W/m.k , Low Modulus, MOT 155 | Data sheet |
| VT-4B5 | IMS, Non-glass, 4.2W/mK | Data sheet |
| VT-4B3 | IMS, Non-glass, 3W/mK | Data sheet |
| VT-5A2 (tec-thermal 5) | High Tg, High Thermal Conductivity laminates & prepreg | Data sheet |
| VT-4A2H PP (tec-thermal 4) | Thermally conductive Laminates & Prepreg | Data sheet |
| VT-4A2H IMS (tec-thermal 4) | Thermally conductive IMS | Data sheet |
Laird Technologies substrates
As a world leader in thermal management solutions, Laird Technologies offers the Tlam™ thermally-conductive PCB substrate system. Tlam™ thermally-conductive PCB substrates provide 8-10 times the heat dissipation compared to conventional FR4-based PCBs. The miniaturation of electronic devices continues to pack more and more power into smaller and smaller packages. The simplicity of the Tlam™ system takes the heat dissipation requirement in stride without significant design changes. The Tlam™ dielectrics are the key to these high-performance PCB substrates. The Tlam™ dielectric provides electrical isolation, thermal transfer, and adhesion layer for the substrates that are created for your specific needs.
| Tlam™ | ML 1KA | Data sheet |
| Tlam™ | SS 1KA | Data sheet |
| Tlam™ | SS HTD | Data sheet |
| Tlam™ | SS LLD | Data sheet |
Denka substrates
A highly thermally conductive insulated metal substrate (IMS) consisting of an aluminum base, an epoxy-based insulation layer with a high inorganic content filler demonstrating high thermal conductivity, and a conductive foil, thereby realizing thermal resistance equivalent to, or less than that of an alumina ceramic substrate.
| HITT PLATE | Data sheet |
Aismalibar Technologies substrates
IMS Cobritherm ® is made of an aluminium board, epoxy resin with ceramic mineral charge and a copper sheet. Aismalibar is one of the first manufacturers of metallic substrate laminates in the world, and the first one in Europe. The laminates in Aismalibar are base materials used in printed circuits for several applications such as: The automotive industry, lighting by LEDs, electronic components, power circuits, power supplies, and electrical engineering.
| HTC | Data sheet | |
| ALCUP | Data sheet | |
| ALCUPG | Data sheet |
If you are struggling to find the right substrate for your PCB design, you can use our PCB material search tool to find the right material for your project. Don’t forget to watch our YouTube channel for PCB design tips. Contact us for all your Aluminium IMS PCB substrates needs.
This information is for reference only. Verify details like material properties directly with the manufacturer to ensure accuracy.