Polyimide PCB substrates

While not as common as FR-4, polyimide PCB substrates offers unique advantages for specific PCB applications. Its high glass transition temperature (Tg) surpasses FR-4, allowing it to handle significantly higher temperatures without warping or degrading. This makes it ideal for environments with intense heat generation, like high-power electronics or those subjected to extreme external temperatures. Additionally, rigid polyimide boasts exceptional dimensional stability, minimizing thermal expansion and contraction that can cause stress on components in FR-4 boards. This stability is crucial for maintaining precise signal integrity in high-performance applications. Though more expensive than FR-4, rigid polyimide provides superior thermal performance and dimensional stability for PCBs that demand unwavering reliability in scorching environments.