Ventec PCB Substrates
A Taiwan Stock Exchange listed company, Ventec International Group (VIG) is a world leader in the production of high quality, high performance copper clad laminates and prepregs used in a wide range of Printed Circuit Board (PCB) and associated applications. Ventec has full in house R&D capabilities and works closely with customers to customise and develop Ventec PCB substrates that meet their specific needs.
Ventec designs, develops, manufactures and sells high quality copper clad laminates and prepreg bonding materials for the fabrication of a wide variety of printed circuit board (PCB) applications.
They have manufacturing facilities in Taiwan and China, and service centres across Europe and America. They deliver consistently high quality products utilising world class equipment from Japan and Taiwan, in coordination with specifically designed plant layouts and production flows.
With a Global sales & distribution presence, Ventec delivers high quality products together with exceptional customer service, to clients throughout Asia, America & Europe.
They are committed to research & development and there fully equipped in house laboratory includes lab scale treaters and presses, as well as a full suite of test equipment, allowing them to stay at the forefront of product development.
Ventec substrates
| Standard FR4 | ||
|---|---|---|
| VT-42 | Dicy Cured FR4.0 Tg 140 | Data sheet |
| VT-481 | Tg 150 | Data Sheet |
| VT-47 | Tg 180 | Data sheet |
| Polyimide | ||
|---|---|---|
| VT-901 | UL-V0 Polyimide Tg 250 | Data sheet |
| VT-90H | UL-HB Polyimide Tg 250 | Data sheet |
| VT-90H(P) | High performance polyimide | Data sheet |
| VT-901HW | UL-V0 Polyimide Ceramic Filled Prepreg Optimized for filling Metal Core PCBs Tg 250 | Data sheet |
| VT-901PP NF/LF LCTE | No Flow / Low Flow Prepreg Tg 200 LCTE | Data sheet |
| VT-901N | No Flow / Low Flow Prepreg Tg 200 LCTE | Data sheet |
| tec-thermal / Thermal Management & IMS | ||
|---|---|---|
| VT-4BC | Metal Base Laminate, 10W/mK | Data sheet |
| VT-4B7 SP | IMS, Non-Glass, 7W/mK | Data sheet |
| VT-4B7 | IMS, Non-Glass, 7W/mK | Data sheet |
| VT-4B5 SP | IMS, Non-glass, 4.2W/mK | Data sheet |
| VT-4B5H | Metal Base Laminate, 4.2W/m.k, High Tg 210, MOT 150 | Data sheet |
| VT-4B5L | Metal Base Laminate, 3.6W/m.k , Low Modulus, MOT 155 | Data sheet |
| VT-4B5 | IMS, Non-glass, 4.2W/mK | Data sheet |
| VT-4B3 | IMS, Non-glass, 3W/mK | Data sheet |
| VT-5A2 (tec-thermal 5) | High Tg, High Thermal Conductivity laminates & prepreg | Data sheet |
| VT-4A2H PP (tec-thermal 4) | Thermally conductive Laminates & Prepreg | Data sheet |
| VT-4A2H IMS (tec-thermal 4) | Thermally conductive IMS | Data sheet |
| tec-speed / Signal Integrity | ||
|---|---|---|
| tec-speed 8.1 & 8.2 H-PK | Extremely Low Loss, Dk 2.9~3.1 & Df 0.0017~0.0013, Tg 260˚C, Halogen Free, Ultra Low CTE | Data sheet |
| tec-speed 7.0H (VT-463H) | Low Dk & Ultra low Loss, Dk 3.6& Df 0.0028, Tg 220℃, Halogen free & Lead Free Assembly | Data sheet |
| tec-speed 6.0/6.1 H-PK (VT-770 / VT-770LK) | Ultra Low Loss Dk 3.3~3.4 & Df 0.0024, Tg 260˚C, Halogen & Phosphorous Free, Ultra Low CTE | Data sheet |
| tec-speed 6.0 (VT-462SH PP NF/LF) | Low Dk & Very low Loss Dk 3.2 & Df 0.004, Tg 200℃, Halogen Free & Lead Free Assembly | Data sheet |
| tec-speed 6.0 (VT-462S) | Low Dk & very low loss, Dk 3.5 & Df 0.0050, Tg 210℃, Lead Free Assembly | Data sheet |
| tec-speed 5.0 (VT-464G) | Low Dk & very low loss, Dk 3.62 & Df 0.0050, Tg 200℃, Halogen Free & Lead Free Assembly | Data sheet |
| tec-speed 4.0H-PK (VT-464LT) | Low Dk & Low Loss Dk 3.7 & Df 0.0075, Tg 260℃, Halogen & Phosphorous Free | Data sheet |
| tec-speed 3.0 (VT-464L) | Low Dk & Low Loss Dk 3.7 & Df 0.0075, Tg 230℃, Halogen & Lead Free Assembly | Data sheet |
| tec-speed 2.0 (VT-464) | Low Dk & Low Loss Dk 3.8 & Df 0.0095, Tg 200℃, Halogen & Lead Free Assembly | Data sheet |
| tec-speed / RF | ||
|---|---|---|
| tec-speed 30.0 (VT-6880) | High Frequency Laminate | Data sheet |
| tec-speed 30.0 (VT-6735) | High Thermal Conductivity Laminate (over 1 W/mK) | Data sheet |
| tec-speed 30.0 (VT-6710) | Dk 10.2 ceramic-filled PTFE composite material | Data sheet |
| tec-speed 30.0 (VT-6702) | Dk 2.94 ceramic-filled PTFE composite material | Data sheet |
| tec-speed 30.0 (VT-3703/3706) | Dk 3.0 & 6.15 ceramic-filled PTFE composite material | Data sheet |
| tec-speed 20.0 (VTM1000i) | Hydrocarbon Ceramic based Laminate with High Dk (9.8) and Low Df (0.0023) | Data sheet |
| tec-speed 20.0 (VT-870 H1000) | Hydrocarbon Ceramic based Laminate with High Dk (10.2) and Low Df (0.003) | Data sheet |
| tec-speed 20.0 (VT-870 & VT-870 Bondply) | Dk 3.0-3.48 ceramic-filled hydrocarbon thermoset material | Data sheet |
| tec-speed 20.0 (VT-870 H348 TCR) | Laminate with Ticer Thin-Film Resistor Foils | Data sheet |
| tec-pack / IC Packaging | ||
|---|---|---|
| tec-speed 6.0 H-PK (VT-770 / VT-770LK) | Ultra Low Loss Dk 3.3~3.4 & Df 0.0024, Tg 260˚C, Halogen & Phosphorous Free, Ultra Low CTE | Data sheet |
| tec-speed 4.0H-PK (VT-464LT) | Low Dk & Low Loss Dk 3.7 & Df 0.0075, Tg 260℃, Halogen & Phosphorous Free | Data Sheet |
| VT-464GS | Halogen Free, Tg 300℃, High Modulus, Low CTE for Packaging Substrate | Data sheet |
| Bondply | ||
|---|---|---|
| thermal-bond 7.0F VT-4BC RCF | Thermal conductivity — 9 W/mK, Tg 210˚C, Ceramic Filled, Halogen Free, UL MOT 155˚C | Data sheet |
| pro-bond 4C (VT-464LT RCC) | Low Dk/Low Df Resin Coated Copper Bondply | Data sheet |
| pro-bond 7C & 7F (VT-770 RCC & RCF) | Ultra Low Dk/Df Resin Coated Copper & Resin Coated Film Bondply | Data sheet |
| pro-bond 8C (VT-463H RCC) | Ultra Low Dk/Df Resin Coated Copper Bondply | Data sheet |
| pro-bond 20F (VT-8728 RCF) | Ultra Low Dk/Df Resin Coated Film Bondply | Data sheet |
| thermal-bond 3.0F (VT-4B3H RCF) | Thermally Conductive Resin Coated Film Bondply | Data sheet |
| thermal-bond 5.0F (VT-4B7H RCF) | Thermally Conductive Resin Coated Film Bondply | Data sheet |
| Lead Free Assembly | ||
|---|---|---|
| VT-481 | Phenolic Cured, Filled FR4.0 Tg 155 | Data sheet |
| VT-47 | Phenolic Cured, Filled, Low CTE FR4.0 Tg 180 | Data sheet |
| VT-47LT | high Tg, Low CTE, high thermal reliability prepreg | Data sheet |
| Hole Fill Prepreg | Lead-Free High Tg FR4 Prepreg, UL-V0 Polyimide Ceramic Filled Prepreg optimized for filling Metal Core PCBs | Data sheet |
If you are struggling to find the right substrate for your PCB design? You can use our PCB material search tool to find the material right for your project. You can also watch our YouTube channel for PCB design tips.
Sticking with tried-and-true Ventec PCB substrates can be crucial for your project’s success. Alternative substrates might seem tempting, but they can introduce risks. Ventec offers specialized materials meticulously engineered for high-frequency applications. Untested alternatives might not handle heat dissipation or signal integrity as well, leading to malfunctions or performance issues. Additionally, Ventec’s ISO-certified manufacturing ensures consistent quality. Opting for untested materials could introduce hidden defects or inconsistencies, causing production delays or even device failures.
In the long run, the potential problems with alternative substrates can outweigh any initial cost savings.
This information is for reference only. Verify details like material properties directly with the manufacturer to ensure accuracy.