Ventec PCB Substrates

A Taiwan Stock Exchange listed company, Ventec International Group (VIG) is a world leader in the production of high quality, high performance copper clad laminates and prepregs used in a wide range of Printed Circuit Board (PCB) and associated applications. Ventec has full in house R&D capabilities and works closely with customers to customise and develop Ventec PCB substrates that meet their specific needs.

Ventec logo. Four different coloured octagons overlapping each other in the middle. on the right is the text "Ventec International Group" with Chinese characters below the text.

Ventec designs, develops, manufactures and sells high quality copper clad laminates and prepreg bonding materials for the fabrication of a wide variety of printed circuit board (PCB) applications.

They have manufacturing facilities in Taiwan and China, and service centres across Europe and America. They deliver consistently high quality products utilising world class equipment from Japan and Taiwan, in coordination with specifically designed plant layouts and production flows.

With a Global sales & distribution presence, Ventec delivers high quality products together with exceptional customer service, to clients throughout Asia, America & Europe.

They are committed to research & development and there fully equipped in house laboratory includes lab scale treaters and presses, as well as a full suite of test equipment, allowing them to stay at the forefront of product development.

Ventec substrates

 

Standard FR4
VT-42Dicy Cured FR4.0 Tg 140Data sheet
VT-481Tg 150Data Sheet
VT-47Tg 180Data sheet

Polyimide
VT-901UL-V0 Polyimide Tg 250Data sheet
VT-90HUL-HB Polyimide Tg 250Data sheet
VT-90H(P)High performance polyimideData sheet
VT-901HWUL-V0 Polyimide Ceramic Filled Prepreg Optimized for filling Metal Core PCBs Tg 250Data sheet
VT-901PP NF/LF LCTENo Flow / Low Flow Prepreg Tg 200 LCTEData sheet
VT-901NNo Flow / Low Flow Prepreg Tg 200 LCTEData sheet

tec-thermal / Thermal Management & IMS
VT-4BCMetal Base Laminate, 10W/mKData sheet
VT-4B7 SPIMS, Non-Glass, 7W/mKData sheet
VT-4B7IMS, Non-Glass, 7W/mKData sheet
VT-4B5 SPIMS, Non-glass, 4.2W/mKData sheet
VT-4B5HMetal Base Laminate, 4.2W/m.k, High Tg 210, MOT 150Data sheet
VT-4B5LMetal Base Laminate, 3.6W/m.k , Low Modulus, MOT 155Data sheet
VT-4B5IMS, Non-glass, 4.2W/mKData sheet
VT-4B3IMS, Non-glass, 3W/mKData sheet
VT-5A2 (tec-thermal 5)High Tg, High Thermal Conductivity laminates & prepregData sheet
VT-4A2H PP (tec-thermal 4)Thermally conductive Laminates & PrepregData sheet
VT-4A2H IMS (tec-thermal 4)Thermally conductive IMSData sheet

tec-speed / Signal Integrity
tec-speed 8.1 & 8.2 H-PKExtremely Low Loss, Dk 2.9~3.1 & Df 0.0017~0.0013, Tg 260˚C, Halogen Free, Ultra Low CTEData sheet
tec-speed 7.0H (VT-463H)Low Dk & Ultra low Loss, Dk 3.6& Df 0.0028, Tg 220℃, Halogen free & Lead Free AssemblyData sheet
tec-speed 6.0/6.1 H-PK (VT-770 / VT-770LK)Ultra Low Loss Dk 3.3~3.4 & Df 0.0024, Tg 260˚C, Halogen & Phosphorous Free, Ultra Low CTEData sheet
tec-speed 6.0 (VT-462SH PP NF/LF)Low Dk & Very low Loss Dk 3.2 & Df 0.004, Tg 200℃, Halogen Free & Lead Free AssemblyData sheet
tec-speed 6.0 (VT-462S)Low Dk & very low loss, Dk 3.5 & Df 0.0050, Tg 210℃, Lead Free AssemblyData sheet
tec-speed 5.0 (VT-464G)Low Dk & very low loss, Dk 3.62 & Df 0.0050, Tg 200℃, Halogen Free & Lead Free AssemblyData sheet
tec-speed 4.0H-PK (VT-464LT)Low Dk & Low Loss Dk 3.7 & Df 0.0075, Tg 260℃, Halogen & Phosphorous FreeData sheet
tec-speed 3.0 (VT-464L)Low Dk & Low Loss Dk 3.7 & Df 0.0075, Tg 230℃, Halogen & Lead Free AssemblyData sheet
tec-speed 2.0 (VT-464)Low Dk & Low Loss Dk 3.8 & Df 0.0095, Tg 200℃, Halogen & Lead Free AssemblyData sheet

tec-speed / RF
tec-speed 30.0 (VT-6880)High Frequency LaminateData sheet
tec-speed 30.0 (VT-6735)High Thermal Conductivity Laminate (over 1 W/mK)Data sheet
tec-speed 30.0 (VT-6710)Dk 10.2 ceramic-filled PTFE composite materialData sheet
tec-speed 30.0 (VT-6702)Dk 2.94 ceramic-filled PTFE composite materialData sheet
tec-speed 30.0 (VT-3703/3706)Dk 3.0 & 6.15 ceramic-filled PTFE composite materialData sheet
tec-speed 20.0 (VTM1000i)Hydrocarbon Ceramic based Laminate with High Dk (9.8) and Low Df (0.0023)Data sheet
tec-speed 20.0 (VT-870 H1000)Hydrocarbon Ceramic based Laminate with High Dk (10.2) and Low Df (0.003)Data sheet
tec-speed 20.0 (VT-870 & VT-870 Bondply)Dk 3.0-3.48 ceramic-filled hydrocarbon thermoset materialData sheet
tec-speed 20.0 (VT-870 H348 TCR)Laminate with Ticer Thin-Film Resistor FoilsData sheet

tec-pack / IC Packaging
tec-speed 6.0 H-PK (VT-770 / VT-770LK)Ultra Low Loss Dk 3.3~3.4 & Df 0.0024, Tg 260˚C, Halogen & Phosphorous Free, Ultra Low CTEData sheet
tec-speed 4.0H-PK (VT-464LT)Low Dk & Low Loss Dk 3.7 & Df 0.0075, Tg 260℃, Halogen & Phosphorous FreeData Sheet
VT-464GSHalogen Free, Tg 300℃, High Modulus, Low CTE for Packaging SubstrateData sheet

Bondply
thermal-bond 7.0F VT-4BC RCFThermal conductivity — 9 W/mK, Tg 210˚C, Ceramic Filled, Halogen Free, UL MOT 155˚CData sheet
pro-bond 4C (VT-464LT RCC)Low Dk/Low Df Resin Coated Copper BondplyData sheet
pro-bond 7C & 7F (VT-770 RCC & RCF)Ultra Low Dk/Df Resin Coated Copper & Resin Coated Film BondplyData sheet
pro-bond 8C (VT-463H RCC)Ultra Low Dk/Df Resin Coated Copper BondplyData sheet
pro-bond 20F (VT-8728 RCF)Ultra Low Dk/Df Resin Coated Film BondplyData sheet
thermal-bond 3.0F (VT-4B3H RCF)Thermally Conductive Resin Coated Film BondplyData sheet
thermal-bond 5.0F (VT-4B7H RCF)Thermally Conductive Resin Coated Film BondplyData sheet

Lead Free Assembly
VT-481Phenolic Cured, Filled FR4.0 Tg 155Data sheet
VT-47Phenolic Cured, Filled, Low CTE FR4.0 Tg 180Data sheet
VT-47LThigh Tg, Low CTE, high thermal reliability prepregData sheet
Hole Fill PrepregLead-Free High Tg FR4 Prepreg, UL-V0 Polyimide Ceramic Filled Prepreg optimized for filling Metal Core PCBsData sheet

If you are struggling to find the right substrate for your PCB design? You can use our PCB material search tool to find the material right for your project. You can also watch our YouTube channel for PCB design tips.

Sticking with tried-and-true Ventec PCB substrates can be crucial for your project’s success. Alternative substrates might seem tempting, but they can introduce risks. Ventec offers specialized materials meticulously engineered for high-frequency applications. Untested alternatives might not handle heat dissipation or signal integrity as well, leading to malfunctions or performance issues. Additionally, Ventec’s ISO-certified manufacturing ensures consistent quality. Opting for untested materials could introduce hidden defects or inconsistencies, causing production delays or even device failures. 

In the long run, the potential problems with alternative substrates can outweigh any initial cost savings.

This information is for reference only. Verify details like material properties directly with the manufacturer to ensure accuracy.