Ventec: A High-Performance Portfolio of PCB Substrates

Ventec logo. Four different coloured octagons overlapping each other in the middle. on the right is the text "Ventec International Group" with Chinese characters below the text.

Ventec International Group is a prominent global supplier of advanced Ventec PCB substrates. Renowned for their focus on high-performance and high-reliability solutions, Ventec offers a diverse range of materials engineered to meet the stringent demands of modern electronics across various industries.

Ventec’s commitment to material science innovation enables the production of PCBs that perform optimally in diverse and challenging environments, from consumer electronics to critical aerospace systems. Let’s explore some of Ventec’s key PCB substrate offerings, highlighting their characteristics and typical applications.

Detailed information for Ventec’s substrate range can be found here.

Ventec PCB substrate FR4 and High-Performance FR4 Materials: The Industry Standard and Beyond

FR4 remains the most widely used PCB substrate due to its excellent balance of electrical, mechanical, and thermal properties, combined with cost-effectiveness. Ventec PCB substrates offers robust standard and enhanced FR4 options:

  • Ventec VT-42: This is a reliable standard FR4 material (Tg 140°C), providing a solid foundation for a broad range of general-purpose applications in sectors like computing, communication equipment, and automotive electronics.
  • Ventec VT-47: As a high-Tg FR4 material (Tg 180°C), VT-47 is designed for enhanced thermal reliability, making it suitable for lead-free assembly processes. It is widely utilized in high-layer count PCBs, industrial controls, and networking equipment where thermal stability is paramount.

Polyimide Materials: Ventec VT-901 for Extreme Reliability

Ventec VT-901 is a high-performance polyimide laminate and prepreg. Polyimide materials are highly valued for their exceptional thermal resistance, mechanical toughness, and very low Z-axis Coefficient of Thermal Expansion (CTE). These properties make VT-901 ideal for applications demanding extreme reliability and high-layer count boards that undergo repeated thermal cycling.

  • Ultra-Thin Capabilities: VT-901 is available in very thin core thicknesses (down to 0.002″ / 0.05mm), which enables high-density interconnect (HDI) and compact, multi-layer designs crucial for advanced electronic packaging.

Key Features of VT-901 (Polyimide): Very high Tg (typically 250°C), high Td (Thermal Decomposition Temperature) at 390°C, excellent thermal stability, superior fracture toughness, low Z-axis CTE, and meeting stringent requirements for aerospace and military applications.

Typical Applications: Aerospace and defence, burn-in boards, chip manufacturing, engine/flight controls, medical devices, and high-reliability industrial equipment.

Low Loss & Ultra-Low Loss Materials (Ventec's tec-speed series): For High-Speed and High-Frequency Signals

As electronic devices push towards higher frequencies and faster data rates, low loss materials become essential to ensure signal integrity and minimize attenuation. Ventec’s tec-speed series is specifically designed for these demanding applications.

  • Ventec tec-speed 3.0: An excellent example within the series, offering improved electrical performance and thermal reliability, suitable for mid-to-high speed digital applications.
  • Ventec tec-speed 6.0/6.1: These materials provide significantly lower Dk (Dielectric Constant) and Df (Dissipation Factor) values, catering to demanding high-speed digital and RF applications.
  • Ventec tec-speed 8.1 & 8.2: Representing even higher performance, these materials offer extremely low Dk and Df, crucial for the most sensitive high-frequency signal transmission.
  • Ventec tec-speed 20.x and 30.x series: These advanced materials are specifically engineered for cutting-edge RF and millimetre-wave applications, offering ultra-low loss characteristics across a broad frequency spectrum.

Key Features: Extremely low Dk and Df, superior signal integrity, minimal signal loss, excellent for controlled impedance designs, and reduced dispersion at high frequencies.

Typical Applications: 5G and next-generation telecommunications infrastructure, high-speed servers and data centres, automotive radar, advanced computing, and satellite communication systems.

Halogen-Free Materials: Environmentally Responsible Choices

Ventec PCB Substrates are committed to environmental responsibility, offering a range of halogen-free materials that comply with various global environmental regulations.

  • Ventec VT-441: This is Ventec’s widely used halogen-free FR4.1 material, providing reliable thermal and electrical performance while adhering to environmental standards.
  • Ventec VT-447: This is a halogen-free, high-Tg (175°C) FR-4.1 laminate. It offers excellent thermal reliability (Td 370°C), good CAF resistance, and low Z-axis CTE, making it ideal for lead-free assembly and multilayer PCBs in demanding applications like mobile phones and communication equipment.

Typical Applications: Consumer electronics, industrial electronics, telecommunications, and any application requiring compliance with environmental directives.

Thermal Management Materials (Ventec tec-thermal IMS): For Efficient Heat Dissipation

For power electronics and high-power applications where efficient heat dissipation is critical, Ventec provides specialized Insulated Metal Substrates (IMS) and thermally conductive laminates.

  • Ventec VT-4BC, VT-4B5, VT-5A2 (tec-thermal series): These are examples of Ventec’s IMS materials. They typically feature a metal base (such as aluminum or copper) bonded with a highly thermally conductive dielectric layer, designed to efficiently dissipate heat away from critical components.

Key Features: High thermal conductivity, superior heat dissipation, and improved thermal reliability, crucial for extending component lifespan in high-power applications.

Typical Applications: LED lighting, automotive power electronics, motor drives, power supplies, and industrial control systems.

Flexible & Rigid-Flex Materials: Enabling Innovative Design

Ventec also supplies materials that facilitate flexible and rigid-flex PCB constructions, enabling innovative and compact electronic packaging solutions. These typically involve specialized polyimide films and advanced adhesive systems, crucial for multi-dimensional circuit designs.

  • Ventec VT-901PP: This is a high-performance polyimide prepreg designed to complement VT-901 polyimide laminates. It is ideal for high-reliability, multi-layer applications requiring exceptional thermal stability (Tg 250°C), low Z-axis CTE, and superior toughness, often used in aerospace, defence, and high-temperature environments.
  • Ventec tec-speed 6.0 – VT-462SH PP NF/LF: This is an ultra-low loss prepreg within the tec-speed 6.0 series. It is engineered for highly controlled impedance and signal integrity in high-frequency and high-speed digital applications, making it essential for advanced networking, 5G, and data centre equipment.

Key Features: High flexibility, excellent bend endurance, space optimization, and reduced weight, allowing for dynamic and 3D interconnects.

Typical Applications: Wearable technology, medical implants, automotive infotainment systems, cameras, and aerospace sensors.

Conclusion

Ventec International Group offers a sophisticated and diverse portfolio of Ventec PCB substrates. From reliable standard FR4s to cutting-edge polyimides and ultra-low loss solutions, their product range caters to a vast array of electronic applications. Understanding the specific material properties and how they align with your design requirements—whether it’s thermal management, signal speed, or environmental compliance—is key to selecting the optimal Ventec substrate for unparalleled performance and reliability.

Contact us today about your requirements and start the manufacturing process before your design is finished! You can also checkout our YouTube channel for more hints and tips.

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